东京精密 TOKYO SEIMITSU A-WD-300T 晶圆切割机用途:主要用于 300mm 晶圆的切割作业,将整片晶圆精准分离成单个芯片,在半导体制造的后端封装环节至关重要,助力提升芯片生产效率与良品率,适用于硅基集成电路、分立器件、光电器件、传感器等多种半导体产品的划切工艺 。性能:采用面对面双主轴布局,专为 300mm 晶圆切割设计。具备高稳定性与低振动特性,保障切割的高精度。X 轴驱动机制可能采用先进技术,减少振动并增强切割质量,切割速度表现优秀,可实现高效切割作业,满足大规模生产需求 。
Product Name: TOKYO SEIMITSU A-WD-300T Wafer DicerPurpose: It is mainly used for the dicing of 300mm wafers, precisely separating the whole wafer into individual chips. It is crucial in the back-end packaging process of semiconductor manufacturing, helping to improve chip production efficiency and yield. It is suitable for the scribing and cutting processes of various semiconductor products such as silicon-based integrated circuits, discrete devices, optoelectronic devices, and sensors.Performance: It adopts a face-to-face twin-spindle layout, specifically designed for 300mm wafer dicing. It has high stability and low vibration characteristics, ensuring high-precision dicing. The X-axis drive mechanism may adopt advanced technology to reduce vibration and enhance dicing quality. It has an excellent cutting speed, enabling efficient cutting operations to meet the needs of mass production.