伊智电子 ESI ESI 9350 高性能激光半导体加工系统用途：专为半导体制造和印刷电路板（PCB）生产设计，用于处理金属存储链路材料等半导体加工环节。性能：采用专利的 1.3µm 波长激光，能精准加工金属存储链路材料，可使用更高能量切割链路，且不损伤周围硅材料，切割更干净，提高良率。具备高精度定位和连续晶圆处理能力，能确保半导体制造的精准与高效。有 2.3µm 激光光斑，可适应最新半导体器件尺寸缩小、链路间距更小的需求。更高重复频率的激光器和配备新软件的更快嵌入式控制器，大幅提升了处理量 。

Product Name: ESI ESI 9350 High - Performance Laser Semiconductor Processing SystemPurpose: Specifically designed for semiconductor manufacturing and printed circuit board (PCB) production, it is used in semiconductor processing such as handling metal memory link materials.Performance: It adopts a patented 1.3µm wavelength laser, which can precisely process metal memory link materials. Higher energy can be used to cut links without damaging the surrounding silicon materials, resulting in cleaner cuts and higher yields. It has high - accuracy positioning and continuous wafer processing capabilities, ensuring precision and efficiency in semiconductor manufacturing. With a 2.3µm laser spot, it can adapt to the shrinking size of the latest semiconductor devices and smaller link pitches. A higher repetition rate laser and a faster embedded controller with new software also significantly improve throughput.