迪斯科 DISCO DFL7160 全自动激光划片机用途：用于 300mm 晶圆的切割，支持多种应用，包括全切割和 Daf 切割，能对硅、化合物半导体进行切割，还可去除低 k 沟槽或切割道上的 TEG。适用于半导体制造后端封装环节，可将晶圆精准分离成单个芯片，也用于晶圆单芯片分离、异形切割以及封装前的预切割等 。性能：采用脉冲激光实现非热加工，减少加工变形与热损伤。激光波长 355mm ，最大功率 15W 。可配备 Hogo max 涂层 / 清洁机制，防止激光加工颗粒污染晶圆。能自动检查和调整激光切割位置，确保稳定加工。设备还采用短脉冲激光，降低因发热产生的影响，实现高质量加工。工作电压 380 - 415VAC，三相，50/60HZ，满载电流 10A ，机器主断路器额定值 29A ，最大负载 5A ，配备 8 英寸玻璃吸盘工作台和 Orion RKS - 600S - VA - 200 单元冷却器 。

Product Name: DISCO DFL7160 Fully Automatic Laser DicerPurpose: It is used for the dicing of 300mm wafers and supports various applications, including full cut and Daf cut. It can cut silicon and compound semiconductors and remove TEG on low - k grooves or streets. It is suitable for the back - end packaging process of semiconductor manufacturing, can precisely separate wafers into individual chips, and is also used for single - chip separation of wafers, irregular dicing, and pre - dicing before packaging.Performance: It uses a pulse laser to achieve non - thermal processing, reducing processing distortion and thermal damage. The laser wavelength is 355mm, and the maximum power is 15W. It can be equipped with the Hogo max coating/cleaning mechanism to prevent the contamination of wafers by laser processing particles. It can automatically check and adjust the laser cutting position to ensure stable processing. The equipment also uses a short - pulse laser to reduce the impact of heating and achieve high - quality processing. The working voltage is 380 - 415VAC, three - phase, 50/60HZ, the full - load current is 10A, the machine main breaker rating is 29A, the largest load is 5A, and it is equipped with an 8 - inch glass chuck table and an Orion RKS - 600S - VA - 200 unit cooler.