迪思科 DISCO DFL7020 激光划片机用途:用于半导体晶圆的高精度切割,能将晶圆精准分离成单个芯片,广泛应用于半导体制造后端封装环节,适用于硅基集成电路、分立器件、光电器件、传感器等各类半导体产品的划切工艺 。性能:作为 DISCO 针对薄晶圆加工优化的机型,具备卓越的切割精度与稳定性,可有效应对薄片切割难题,满足多种高难度划片需求。经规范调试后,在二手市场也能保持稳定性能 。
Product Name: DISCO DFL7020 Laser DicerPurpose: It is used for the high - precision cutting of semiconductor wafers. It can precisely separate wafers into individual chips and is widely applied in the back - end packaging process of semiconductor manufacturing. It is suitable for the scribing and cutting processes of various semiconductor products such as silicon - based integrated circuits, discrete devices, optoelectronic devices, and sensors.Performance: As a model optimized by DISCO for thin - wafer processing, it has excellent cutting accuracy and stability. It can effectively handle the challenges of thin - film cutting and meet various high - difficulty dicing requirements. After standard debugging, it can also maintain stable performance in the second - hand market.