迪斯科 DISCO DAD341 晶圆划片机用途：主要用于半导体制造领域，将硅、玻璃、陶瓷等材料的晶圆切割成单个芯片。适用于芯片制造和封装环节，可处理不同材质的工件，满足多种生产需求。性能：能容纳最大厚度为 4mm 的基板，支持最大尺寸达 8 英寸（203mm）的晶圆。配备 6000 - 60000rpm 的单轴超高性能主轴，切割速度可达 400mm/s。内置双 CCD 视觉对准系统，定位精度达到 ±2μm。测量分辨率为 0.1μm，切割精度高。具备自动和半自动两种工作模式，可自动完成整片晶圆切割，也能进行定制化切割。支持对硅、蓝宝石、派热克斯玻璃、石英、碳化硅、陶瓷及金属等多种材料进行异形加工 。

Product Name: DISCO DAD341 Wafer Dicing SawPurpose: It is mainly used in the semiconductor manufacturing field to cut wafers made of materials such as silicon, glass, and ceramics into individual chips. It is suitable for chip manufacturing and packaging processes, can handle workpieces of different materials, and meets various production needs.Performance: It can accommodate substrates with a maximum thickness of 4mm and support wafers with a maximum size of 8 inches (203mm). It is equipped with a single - axis ultra - high - performance spindle with a speed range of 6000 - 60000rpm, and the cutting speed can reach 400mm/s. It has a dual - CCD vision alignment system with a positioning accuracy of ±2μm. The measurement resolution is 0.1μm, ensuring high cutting accuracy. It has two working modes, automatic and semi - automatic. It can automatically complete the cutting of the entire wafer and can also perform customized cutting. It supports the shaping of various materials such as silicon, sapphire, Pyrex glass, quartz, silicon carbide, ceramics, and metals.