迪斯科 DISCO DFL7340 全自动激光切割机用途：主要用于半导体制造领域，对晶圆及各类封装基板进行切割。可处理硅基材料、砷化镓、氮化镓等化合物半导体材料，适用于从基础半导体器件到先进封装等多种生产环节 。性能：激光器波长有 1064nm（红外）和 355nm（紫外）可选。最高脉冲重复频率达 200kHz ，平均功率 30W 。最大切割速度可达 500mm/s 。XY 轴定位精度为 ±1μm ，重复定位精度达 ±0.5μm ，切割精度极高。配备高精度视觉对准系统，对准精度可达 ±1μm 。支持 4 - 12 英寸晶圆及各类封装基板的切割，可处理 50μm - 700μm 厚度的材料 。

Product Name: DISCO DFL7340 Automatic Laser Cutting MachinePurpose: It is mainly used in the semiconductor manufacturing field to cut wafers and various packaging substrates. It can process silicon - based materials, compound semiconductor materials such as gallium arsenide and gallium nitride, and is suitable for a variety of production processes from basic semiconductor devices to advanced packaging.Performance: The laser wavelength can be selected as 1064nm (infrared) or 355nm (ultraviolet). The maximum pulse repetition frequency reaches 200kHz, and the average power is 30W. The maximum cutting speed can reach 500mm/s. The XY - axis positioning accuracy is ±1μm, and the repeat positioning accuracy reaches ±0.5μm, with extremely high cutting accuracy. It is equipped with a high - precision visual alignment system, and the alignment accuracy can reach ±1μm. It supports the cutting of 4 - 12 - inch wafers and various packaging substrates, and can process materials with a thickness of 50μm - 700μm.