dxit ron DBM - 402R 裂片机用途：该半自动裂片机主要用于 LD/LED 半导体基板和条形芯片的切割工作。适用于 GaAs、InP、蓝宝石、Si 等材料，可依据预先设定的条件，对用刀片划线后的相关材料进行自动断开操作 。性能：可处理 3、4 英寸晶圆，型号为 DBM - 402NR。手动操作环到舞台的设置，而参数设定以及门的定位、断开等步骤自动实施 。

Product Name: dxit ron DBM - 402R Dicing MachinePurpose: This semi - automatic dicing machine is mainly used for the cutting of LD/LED semiconductor substrates and bar - shaped chips. It is suitable for materials such as GaAs, InP, sapphire, and Si. It can automatically break the materials that have been scribed with a blade according to pre - set conditions.Performance: It can process 3 - inch and 4 - inch wafers, with the model being DBM - 402NR. The setting from the manual operation ring to the stage is carried out manually, while the parameter setting, the positioning of the door, and the breaking are automatically implemented.