应用材料 AMAT CENTRIS ITZA 4 ZONE 等离子体刻蚀设备用途：用于半导体制造，通过精准的等离子体刻蚀工艺，在晶圆表面去除特定材料，构建精确的电路图案，对逻辑芯片、存储芯片等各类芯片的制造至关重要 。性能：采用四分区独立控制技术，可精准调节各区域等离子体密度与能量，实现 12 英寸晶圆高均匀性刻蚀，面内均匀性误差控制在 ±1.5% 以内。搭载的高效等离子体源，能产生高密度、高稳定性等离子体，刻蚀选择比高达 150:1，有效保护底层材料，确保复杂电路结构精准成型。模块化腔体设计便于快速更换工艺组件，支持多种产品刻蚀工艺切换，设备综合稼动率可达 92% 以上 。

Product Name: Applied Materials AMAT CENTRIS ITZA 4 ZONE Plasma Etching EquipmentPurpose: It is used in semiconductor manufacturing. Through precise plasma etching processes, it removes specific materials on the wafer surface to construct accurate circuit patterns, which is crucial for the manufacturing of various chips such as logic chips and memory chips.Performance: It adopts four - zone independent control technology, which can precisely adjust the plasma density and energy in each zone to achieve highly uniform etching of 12 - inch wafers, with the in - plane uniformity error controlled within ±1.5%. The high - efficiency plasma source it is equipped with can generate high - density and high - stability plasma, with an etching selectivity ratio of up to 150:1, effectively protecting the underlying materials and ensuring the precise formation of complex circuit structures. The modular chamber design facilitates the rapid replacement of process components, supports the switching of etching processes for a variety of products, and the comprehensive equipment utilization rate can reach over 92%.