TE-F0RMULA-1S-H 蚀刻机 / 去胶机。英文：TE-F0RMULA-1S-H Etcher/Asher.

用途：用于需要快速、精确和精细蚀刻工艺的应用场合。英文：It is designed for applications where a quick, precise and fine etching process is required.

性能：配备精密蚀刻腔，适用于高纵横比结构蚀刻，能保证低垂直侵蚀轮廓，可高精度定义复杂三维结构。具有自动晶圆识别、板载化学管理工具等用户友好功能，且吞吐量高，能在较短工艺时间内产生高质量蚀刻结果，还可承受高功率射频场和极端温度，可靠性强。英文：It is equipped with a precision etch chamber, suitable for etching high - aspect - ratio structures, ensuring a low vertical erosion profile. It can define complex three - dimensional structures with high accuracy. It has user - friendly functions such as automatic wafer recognition and on - board chemical management tools. It also has a high throughput rate, producing high - quality etch results in a relatively short process time, and is reliable enough to withstand high - power RF fields and extreme temperatures.