SAMCO RIE - 300NR 反应离子刻蚀系统用途：适用于半导体微细加工领域，可对硅、二氧化硅、SiN、聚硅氧烷等多种材料进行刻蚀，还能用于去除夹层膜、树脂蚀刻、脱胶，光阻剂灰化、剥离、除尘及材料表面改性等，在科研与量产场景均有应用 。性能：采用平行板电极结构与高频、低频双电源控制，能精准调控离子能量与化学反应速率。真空腔体由耐腐蚀材料打造，保障刻蚀洁净度。支持 4 路独立气体输入，可精确配比多种刻蚀气体。能加工 ø350mm（如 ø3"×12，ø4"×8，ø12"×1）范围的晶圆，优化的喷淋头确保工艺气体均匀性。自动压力控制可精准把控工艺压力，不受气体流量干扰 。

Product Name: SAMCO RIE - 300NR Reactive Ion Etching SystemPurpose: It is suitable for the semiconductor micro - processing field. It can etch a variety of materials such as silicon, silicon dioxide, SiN, polysiloxane, etc. It can also be used for removing interlayer films, resin etching, degumming, photoresist ashing, stripping, dust removal, and material surface modification. It is applied in both scientific research and mass - production scenarios.Performance: It adopts a parallel - plate electrode structure and high - frequency and low - frequency dual - power control, which can precisely regulate the ion energy and chemical reaction rate. The vacuum chamber is made of corrosion - resistant materials to ensure the cleanliness of etching. It supports 4 - channel independent gas input and can accurately proportion a variety of etching gases. It can process wafers in the range of ø350mm (such as ø3"×12, ø4"×8, ø12"×1). The optimized showerhead ensures the uniformity of process gases. Automatic pressure control can precisely control the process pressure without being affected by gas flow.