DRY ETCHING SYSTEM GAEA5002 等离子体刻蚀设备用途：用于半导体制造领域，通过等离子体与材料的物理化学作用，精准去除晶圆表面材料，实现电路图案的精确构建，对芯片性能与良率有直接影响。广泛应用于中小规模生产及科研场景 。性能：采用感应耦合等离子体技术，能稳定生成等离子体。配备多通道气体控制系统，支持多种刻蚀气体组合输入，可通过调节气体比例与射频功率，精准把控刻蚀速率与选择比，满足不同工艺需求。其腔体设计紧凑，占地面积小。高效真空系统抽气速率超 100L/s ，确保刻蚀环境洁净 。

Product Name: DRY ETCHING SYSTEM GAEA5002 Plasma Etching EquipmentPurpose: It is used in the semiconductor manufacturing field. Through the physical and chemical effects of plasma and materials, it accurately removes the materials on the wafer surface to achieve the precise construction of circuit patterns, which has a direct impact on chip performance and yield. It is widely used in small - and medium - scale production and scientific research scenarios.Performance: It adopts inductively coupled plasma technology to stably generate plasma. It is equipped with a multi - channel gas control system, supporting the combined input of various etching gases. The etching rate and selectivity can be precisely controlled by adjusting the gas ratio and radio - frequency power to meet different process requirements. Its chamber is compactly designed, occupying a small area. The high - efficiency vacuum system has a pumping speed of over 100L/s to ensure a clean etching environment.