NANOLAB TECHNICS MICRO - RIE SERIES 800 反应离子刻蚀系统用途：用于从衬底或工件上蚀刻薄膜，通过将等离子体和离子束结合，去除衬底表面物质。适用于半导体制造、微机电系统（MEMS）加工等领域，可对氮化硅、二氧化硅、单晶硅和多晶硅等材料进行蚀刻。性能：蚀刻电极是直径 9 英寸的不锈钢材质，具备水冷功能。配备 200 瓦（可变）、30 千赫兹的射频电源。设有两个带有质量流量控制器（MFC）的气体通道，能精准控制蚀刻气体流量。该系统具有较高精度，在小尺寸和大尺寸晶圆开发方面展现出与高容量系统相媲美的能力，也非常适合集成电路和混合电路器件的分析 。

Product Name: NANOLAB TECHNICS MICRO - RIE SERIES 800 Reactive Ion Etching SystemPurpose: It is used to etch thin films from substrates or workpieces. By combining plasma and ion beams, it removes substances on the substrate surface. It is suitable for fields such as semiconductor manufacturing and micro - electromechanical systems (MEMS) processing, and can etch materials such as silicon nitride, silicon dioxide, single - crystal silicon, and polycrystalline silicon.Performance: The etch electrode is made of stainless steel with a diameter of 9 inches and has a water - cooling function. It is equipped with an RF power supply of 200 watts (variable) and 30 kHz. There are two gas channels with mass flow controllers (MFCs) to accurately control the flow rate of the etching gas. This system has high precision and shows capabilities comparable to high - capacity systems in the development of small and large wafers. It is also very suitable for the analysis of integrated circuits and hybrid circuit devices.