东京精密 TOKYO SEIMITSU UF 190R用途：适用于半导体行业中分立器件的 200mm 晶圆测试，可对切割后附在框架上的晶圆以及封装进行高精度测量，满足企业对晶圆产品质量检测的需求。性能：能传输和测量 4 英寸至 8 英寸晶圆。采用与 UF2000 相同的 MMI（人机界面）。拥有多种选项，可实现行业标准未定义的各类晶圆测试。运用校正技术，对切割后附在框架上的晶圆和封装进行高精度测量。设备整体具备较高的性价比，且与 UF200 在如自动探针对齐功能及全彩触摸面板等方面完全兼容，操作便捷，有助于提升测试效率。

英文Product Name: TOKYO SEIMITSU UF 190RPurpose: It is applicable to the testing of 200mm wafers for discrete devices in the semiconductor industry. It can conduct high - precision measurements on wafers attached to frames after cutting and packages, meeting the needs of enterprises for wafer product quality inspection.Performance: It can transfer and measure wafers from 4 - inch to 8 - inch. It adopts the same MMI (Man - Machine Interface) as UF2000. It has a variety of options to achieve various wafer tests that are not defined by industry standards. Using calibration technology, it conducts high - precision measurements on wafers attached to frames after cutting and packages. The equipment as a whole has a high cost - performance ratio and is fully compatible with UF200 in aspects such as automatic probe alignment function and full - color touch panel, which is convenient to operate and helps to improve testing efficiency.