东京精密 TOKYO SEIMITSU UF 200A用途：主要用于半导体、电子元器件等行业中 5-8 英寸晶圆的性能测试。能对集成电路进行电性能测试、晶圆级可靠性检测等，助力企业把控产品质量。性能：采用 OTS 光学自动对准技术，综合精度可达 ±2um。具备 inkless map、multisite 测试功能，可进行最高 150 度的高温测试。可提供最高 200g 的探测力，适配高密度细间距产品检测。其专利十字形 Z 轴设计，使运动精准且降低空转与噪音。自动静电吸盘维持测试表面平整。配备便捷软件，支持多种模拟和数字测量，可用于热测试。还设有卡盘加热器、热卡盘、探针臂等多种可选配件，以提升测试效率。

英文Product Name: TOKYO SEIMITSU UF 200APurpose: It is mainly used for performance testing of 5 - 8 inch wafers in industries such as semiconductors and electronic components. It can conduct electrical performance testing of integrated circuits, wafer - level reliability testing, etc., helping enterprises control product quality.Performance: It adopts OTS optical automatic alignment technology with a comprehensive accuracy of up to ±2um. It has functions like inkless map and multisite testing and can carry out high - temperature testing up to 150 degrees. It can provide a maximum probing force of 200g, suitable for detecting high - density fine - pitch products. Its patented cross - shaped Z - axis design makes the movement accurate and reduces idle motion and noise. The automatic electrostatic chuck maintains a flat test surface. It is equipped with convenient software, supporting various analog and digital measurements and can be used for thermal testing. There are also various optional accessories such as a chuck heater, a hot chuck, probe arms, etc., to improve testing efficiency.