东京精密 TOKYO SEIMITSU UF 190A用途：主要应用于半导体领域，适用于对 200mm 晶圆进行测试。能够精准检测晶圆性能，尤其在分立器件的晶圆测试方面表现出色，帮助企业有效把控产品质量。性能：可对 4 英寸至 8 英寸的晶圆进行稳定传输与测量。设备采用先进的技术架构，配备高精度的测量组件，能实现精准测量。通过特殊的校正技术，可对切割后附在框架上的晶圆以及封装进行高精度测量，满足半导体行业严格的质量检测需求。同时，该设备拥有多种可选配置，能灵活应对各类非标准的晶圆测试场景，为企业提供多样化的测试方案。

英文Product Name: TOKYO SEIMITSU UF 190APurpose: It is mainly applied in the semiconductor field and is suitable for testing 200mm wafers. It can accurately detect wafer performance, especially performing well in the wafer testing of discrete devices, helping enterprises effectively control product quality.Performance: It can stably transfer and measure wafers from 4 - inch to 8 - inch. The device adopts an advanced technical architecture and is equipped with high - precision measuring components to achieve accurate measurement. Through a special calibration technology, it can conduct high - precision measurements on wafers attached to frames after cutting and packages, meeting the strict quality inspection requirements of the semiconductor industry. At the same time, this device has a variety of optional configurations and can flexibly respond to various non - standard wafer testing scenarios, providing diversified testing solutions for enterprises.