东京精密 TOKYO SEIMITSU UF 200FL用途：主要用于半导体、电子元器件等领域的晶圆测试，尤其适用于 5-8 英寸晶圆的性能检测，能够对集成电路进行全面分析。性能：可稳定处理 5 - 8 英寸晶圆。采用先进的 OTS 光学自动对准技术，综合精度达 ±2um 。具备 inkless map、multisite 测试功能，最高可进行 150 度高温测试。能提供最高 200g 的探测力，适配高密度细间距产品检测。其专利十字形 Z 轴设计，运动精准且可降低空转与噪音。自动静电吸盘确保测试表面平整。配备的用户友好型软件，支持多种模拟和数字测量，可用于热测试。另有卡盘加热器、热卡盘、探针臂等多种可选配件，提升测试效率。

英文Product Name: TOKYO SEIMITSU UF 200FLPurpose: It is mainly used for wafer testing in fields such as semiconductors and electronic components, especially suitable for performance testing of 5 - 8 inch wafers, and capable of comprehensive analysis of integrated circuits.Performance: It can stably handle 5 - 8 inch wafers. It adopts advanced OTS optical automatic alignment technology with a comprehensive accuracy of ±2um. It has functions like inkless map and multisite testing, and can conduct high - temperature testing up to 150 degrees. It can provide a maximum probing force of 200g, suitable for detecting high - density fine - pitch products. Its patented cross - shaped Z - axis design ensures accurate movement and reduces idle motion and noise. The automatic electrostatic chuck ensures a flat test surface. The equipped user - friendly software supports various analog and digital measurements and can be used for thermal testing. There are also various optional accessories such as a chuck heater, a hot chuck, probe arms, etc., to improve testing efficiency.