东京精密 TOKYO SEIMITSU UF 190B用途：专为半导体行业设计，适用于对 200mm 晶圆进行高精度测试，尤其擅长分立器件的晶圆测试，能够满足企业在晶圆质量检测方面的严格要求。性能：可稳定传输和测量 4 英寸至 8 英寸晶圆。配备先进的人机交互系统，操作简便。采用独特的校正技术，能对切割后附在框架上的晶圆以及封装进行精准测量，测量精度极高。该设备拥有多种可选配置，能灵活应对行业内各类非标准的晶圆测试场景，为企业提供多样化的测试解决方案，助力提升产品质量把控能力。

英文Product Name: TOKYO SEIMITSU UF 190BPurpose: Specifically designed for the semiconductor industry, it is suitable for high - precision testing of 200mm wafers. It is especially good at testing wafers of discrete devices and can meet the strict requirements of enterprises in wafer quality inspection.Performance: It can stably transfer and measure wafers from 4 - inch to 8 - inch. It is equipped with an advanced human - machine interaction system, which is easy to operate. Using a unique calibration technology, it can accurately measure wafers attached to frames after cutting and packages. The measurement accuracy is extremely high. This device has a variety of optional configurations and can flexibly respond to various non - standard wafer testing scenarios in the industry, providing diversified testing solutions for enterprises and helping to improve product quality control capabilities.