东京精密 TOKYO SEIMITSU FP 3000用途：适用于半导体封装测试领域，可对各类封装器件（如 BGA、QFP 等）进行高精度外观检测与尺寸测量，广泛应用于电子制造行业的质量筛查环节。性能：检测范围覆盖 5mm×5mm 至 30mm×30mm 封装件，光学分辨率达 1μm。配备高速图像传感器，检测速度达 2000 件 / 小时，缺陷识别精度 0.01mm。采用多光源照明系统，支持多角度成像，可识别划痕、缺角、锡球异常等缺陷。X/Y 轴定位精度 ±1.5μm，支持自动上料与分类功能，适配批量生产检测需求。

英文Product Name: TOKYO SEIMITSU FP 3000Purpose: It is applicable to the field of semiconductor packaging testing, capable of high-precision appearance inspection and dimension measurement of various packaged devices (such as BGA, QFP, etc.), and widely used in quality screening links of the electronic manufacturing industry.Performance: The detection range covers 5mm×5mm to 30mm×30mm packages, with an optical resolution of 1μm. Equipped with a high-speed image sensor, the detection speed reaches 2000 pieces/hour, and the defect recognition accuracy is 0.01mm. Adopting a multi-light source lighting system, it supports multi-angle imaging and can identify defects such as scratches, missing corners, and solder ball abnormalities. The X/Y axis positioning accuracy is ±1.5μm, supporting automatic feeding and classification functions, suitable for batch production inspection needs.