东京精密 TOKYO SEIMITSU UF 200用途：适用于 5 - 8 英寸晶圆测试，常用于半导体、电子元器件等领域的集成电路测试，能对晶圆产品进行性能检测与分析。性能：可传输和测量 5 - 8 英寸晶圆。采用 OTS 光学自动对准技术，综合精度达 ±2um。具备 inkless map、multisite 测试功能，支持最高 150 度高温测试。可提供最高 200g 的探测力，满足高密度细间距产品检测需求。拥有专利的十字形 Z 轴设计，运动轻盈、精度高且可降低空转运动和噪音。配备自动静电吸盘，保障测试表面平整。搭载用户友好型软件，能进行多种模拟和数字测量，也可用于热测试。此外，还有多种可选配件，如卡盘加热器、热卡盘、探针臂等，以提升工作效率。

英文Product Name: TOKYO SEIMITSU UF 200Purpose: It is suitable for 5 - 8 inch wafer testing and is often used for integrated circuit testing in fields such as semiconductors and electronic components, capable of detecting and analyzing the performance of wafer products.Performance: It can transfer and measure 5 - 8 inch wafers. It adopts OTS optical automatic alignment technology with a comprehensive accuracy of ±2um. It has functions like inkless map and multisite testing and supports high - temperature testing up to 150 degrees. It can provide a maximum probing force of 200g to meet the detection requirements of high - density fine - pitch products. It has a patented cross - shaped Z - axis design, featuring light and highly accurate motion, reducing idle motion and noise. It is equipped with an automatic electrostatic chuck to ensure a flat test surface. It is equipped with a user - friendly software that can perform various analog and digital measurements and can also be used for thermal testing. In addition, there are various optional accessories such as a chuck heater, a hot chuck, probe arms, etc., to improve work efficiency.