东京精密 TOKYO SEIMITSU UF200A用途：适用于 200mm 晶圆的测试，常用于分立器件测试场景。在 WAT/CP 测试、I-V／C-V 测试、RF/mmW 测试等半导体测试领域以及在片老化、高低温测试、光电器件测试及晶圆级失效分析等方面应用广泛。性能：X-Y 轴单轴最大探测范围达 ±120mm ，速度为 300mm/s；Z 轴最大探测范围 69mm ，速度 30mm/s ，θ 轴旋转速度 + 5 deg 。采用开环系统和轻量化 Z 轴系统，提升生产效率。垂直分辨率为 5µm ，Z 轴公差 10µm ，可测量槽上方 4mm 处。探针头能 360 度旋转，减少多焊盘需求。搭配两台数字直线电机，重复精度高、速度快。运用数字控制技术，精准控制探针位置与小探测力，保护样品。可按需选配自动探针对准、彩色触摸面板等功能 。

Product Name: TOKYO SEIMITSU UF200A by Tokyo SeimitsuPurpose: It is suitable for the testing of 200mm wafers and is often used in discrete device testing scenarios. It is widely applied in semiconductor testing fields such as WAT/CP testing, I-V/C-V testing, RF/mmW testing, as well as in - wafer aging, high and low temperature testing, optoelectronic device testing, and wafer - level failure analysis.Performance: The maximum probing range of the X - Y axis per axis reaches ±120mm, with a speed of 300mm/s; the maximum probing range of the Z axis is 69mm, with a speed of 30mm/s, and the rotation speed of the θ axis is +5 deg. It adopts an open - loop system and a lightweight Z - axis system to improve production efficiency. The vertical resolution is 5µm, and the Z - axis tolerance is 10µm. It can measure 4mm above the slot. The probe head can rotate 360 degrees, reducing the need for multiple pads. It is equipped with two digital linear motors, providing high repeatability and fast speed. Digital control technology is used to precisely control the probe position and small probing force to protect the sample. Functions such as automatic probe alignment and a color touch panel can be optionally equipped as needed.