东京电子 TEL Precio用途：属于全自动晶圆探测平台，适用于半导体测试流程中的晶圆探测环节，能满足制程小型化、更高器件功能性和多样封装对探测技术的多样化需求。性能：支持 200mm 和 300mm 晶圆尺寸，采用滚珠丝杠载物台技术。XY 轴探测精度达 ±1.8μm，Z 轴探测精度为 ±5.0μm，可实现更可靠的接触以及更好的 Z 轴控制以进行软接触。探测力为 200/300kg（可选）。光学系统采用 ASU/BCU - Ⅱ ，操作系统是 Windows + VME 。测试时能实现最佳温度控制，并提高并行芯片测试能力 。

Product Name: TEL Precio by Tokyo ElectronPurpose: It belongs to a fully automatic wafer probing platform and is suitable for the wafer probing process in semiconductor testing. It can meet the diversified demands for probing technology brought about by process miniaturization, higher device functionality, and diverse packaging.Performance: It supports wafer sizes of 200mm and 300mm and adopts ball screw stage technology. The XY probing accuracy reaches ±1.8μm, and the Z probing accuracy is ±5.0μm, enabling more reliable contact and better Z - axis control for soft contact. The probing force is 200/300kg (optional). The optical system uses ASU/BCU - Ⅱ, and the operating system is Windows + VME. It can achieve optimal temperature control during testing and improve the parallel die testing capability.