东京电子 TEL P-12XLn用途：是一款高性能的晶圆探针台，用于集成电路特性测量。可进行晶圆温度、电压、电容、电阻等一系列参数的测试，适用于半导体制造、航空航天研究等领域。性能：支持 12 英寸（300mm）晶圆，也可选配 200mm、150mm 规格 。最小芯片尺寸 350um 至 76000um 。探针卡尺寸最大 350mm 。恒温卡盘温度范围 + 25°C 至 +150°C（风冷，精度 ±2°C）。XY 轴整体精度 ±1.8um ，Z 轴整体精度 ±5.0um 。具备自动晶圆地图显示、多芯片探测功能。拥有防震设计、高精度真空吸附载物台、1000 倍光学观察系统，兼容主流测试仪器。还配备自动温度补偿和反馈单元、可检测并补偿探针偏差的运动控制器，可选配真空工具、光刻蚀刻软件等多种工具 。

Product Name: TEL P-12XLn by Tokyo ElectronPurpose: It is a high - performance wafer prober used for measuring the characteristics of integrated circuits. It can test a series of parameters such as wafer temperature, voltage, capacitance, and resistance, and is suitable for fields such as semiconductor manufacturing and aerospace research.Performance: It supports 12 - inch (300mm) wafers, and 200mm and 150mm specifications are also available as options. The minimum die size ranges from 350um to 76000um. The maximum probe card size is 350mm. The constant - temperature chuck has a temperature range of +25°C to +150°C (air - cooled, with an accuracy of ±2°C). The overall accuracy of the X/Y axis is ±1.8um, and that of the Z axis is ±5.0um. It has functions such as real - time wafer map display and multi - die probing. It has a shock - proof design, a high - precision vacuum - adsorption stage, an optical observation system with a magnification of 1000 times, and is compatible with mainstream testing instruments. It is also equipped with an automatic temperature compensation and feedback unit and a motion controller that can detect and compensate for probe misalignment. Multiple tools such as a vacuum tool, lithography and etching software can be optionally equipped.