佳能 CANON PLA 500 FA 掩模对准曝光机用途：适用于半导体制造、集成电路生产、微机电系统（MEMS）研发等领域，可处理 4 - 6 英寸晶圆，用于将掩模图案精准转移至晶圆表面，完成光刻制程，满足芯片、传感器等微小精密部件的制造及科研需求。性能：采用 1:1 投影光学系统，搭配汞灯曝光光源，适用于 i - line（365nm）光刻工艺，分辨率可达 0.5μm，套刻精度为 ±0.3μm。曝光区域为 15×15mm 。借助氦氖（633nm）激光束扫描实现自动或半自动对准，也支持手动对准。照明光源为 250W 超高压汞灯，照明均匀性≤±3%，照明强度≥12mW/cm²。支持接近式、硬接触、软接触等曝光模式。自动晶圆传输与对准系统，实现快速上料、精准定位与曝光，且具备背面晶圆处理功能，可适配 5 英寸、6 英寸掩模版 。

Product Name: CANON PLA 500 FA Mask AlignerPurpose: It is applicable to fields like semiconductor manufacturing, integrated circuit production, and micro - electromechanical systems (MEMS) R & D. It can process 4 - 6 - inch wafers, accurately transfer the mask pattern onto the wafer surface to complete the lithography process, meeting the manufacturing and research needs of tiny and precise components such as chips and sensors.Performance: It adopts a 1:1 projection optical system and is equipped with a mercury lamp exposure light source, suitable for the i - line (365nm) lithography process. The resolution can reach 0.5μm, and the overlay accuracy is ±0.3μm. The exposure area is 15×15mm. It realizes automatic or semi - automatic alignment by scanning with a helium - neon (633nm) laser beam and also supports manual alignment. The illumination light source is a 250W ultra - high - pressure mercury lamp, with illumination uniformity ≤±3% and illumination intensity ≥12mW/cm². It supports exposure modes such as proximity, hard contact, and soft contact. The automatic wafer transfer and alignment system enables fast loading, precise positioning, and exposure. It also has a back - side wafer handling function and can be adapted to 5 - inch and 6 - inch masks.