佳能 CANON PLA 500 Series 掩模对准曝光机用途：适用于半导体制造、微机电系统（MEMS）生产、集成电路研发等领域，可处理 2 至 6 英寸晶圆，用于将掩模图案精准转移至晶圆表面，完成光刻制程，满足芯片、传感器等微小精密部件的制造及科研需求。性能：以部分型号为例，如 PLA 501 最小分辨率可达 1.5μm，套刻精度 ±0.3μm 。曝光区域 15×15mm 。配备 250W 高压汞灯，可产生 g 线（436nm）、h 线（405nm）、i 线（365nm）等用于曝光。支持接近式、硬接触、软接触等曝光模式，通过氦氖（633nm）激光束扫描进行自动或半自动对准。部分型号可实现自动上下料，支持盒对盒操作，且有背面晶圆处理功能，能适配 5 英寸、6 英寸掩模版。

Product Name: CANON PLA 500 Series Mask AlignerPurpose: It is suitable for fields such as semiconductor manufacturing, micro - electromechanical systems (MEMS) production, and integrated circuit R & D. It can process 2 - 6 - inch wafers, accurately transfer the mask pattern onto the wafer surface to complete the lithography process, and meet the manufacturing and research needs of tiny and precise components such as chips and sensors.Performance: Taking some models as examples, such as the PLA 501, the minimum resolution can reach 1.5μm, and the overlay accuracy is ±0.3μm. The exposure area is 15×15mm. It is equipped with a 250W high - pressure mercury lamp, which can generate g - line (436nm), h - line (405nm), i - line (365nm), etc. for exposure. It supports exposure modes such as proximity, hard contact, and soft contact, and uses a helium - neon (633nm) laser beam for automatic or semi - automatic alignment. Some models can achieve automatic loading and unloading, support cassette - to - cassette operation, and have a back - side wafer handling function. They can be adapted to 5 - inch and 6 - inch masks.