OAI 400 掩模对准曝光机用途：适用于半导体制造、MEMS（微机电系统）研发与生产、传感器制作等微纳加工领域，主要用于将掩模版上的图案精确转移到晶圆或其他基底材料表面，完成光刻工序。性能：配备 10 英寸准直镜头，可处理最大 6×6 英寸方形或 200mm 晶圆；具备立体变焦功能，能辅助精准定位；推测其可能具备较高精度的对准系统，实现微米级别的图案对准；大概率配备稳定可靠的曝光光源，以保证曝光过程中光强均匀性，确保图案转移的准确性 。

Product Name: OAI 400 Mask AlignerPurpose: It is applicable to micro - nano processing fields such as semiconductor manufacturing, R & D and production of MEMS (Micro - Electro - Mechanical Systems), and sensor fabrication. It is mainly used to accurately transfer the patterns on the mask to the surface of wafers or other substrate materials, thus completing the lithography process.Performance: Equipped with a 10 - inch collimated lens, it can handle up to 6×6 - inch squares or 200 - mm wafers. It has a stereo - zoom function to assist in precise positioning. Presumably, it may be equipped with a high - precision alignment system to achieve micron - level pattern alignment. It is highly likely to be equipped with a stable and reliable exposure light source to ensure the uniformity of light intensity during exposure and the accuracy of pattern transfer.