卡尔・休斯 KARL SUSS MICROTEC MA-150 REMAN 掩模对准曝光机用途：适用于半导体制造、MEMS 研发、光电子器件生产等微纳加工领域，可将掩模图案精准转移到晶圆等基底材料表面，完成光刻制程。性能：能处理最大 6 英寸晶圆，适配 7×7 英寸掩模。具备顶部对准（TSA）功能，对准精度可达 ±5μm，重复精度 ±1.5μm。有 X、Y、Theta 方向的晶圆台移动控制。配备 350W 高压汞灯，曝光波长 320nm 。支持标准软接触、标准硬接触、软真空和全真空 4 种晶圆与掩模接触模式。光学系统含分视场旋转显微镜，搭配 3.5 倍、10 倍、25 倍物镜及 10 倍双目目镜，有分视场、全左图像、全右图像 3 种观察模式；还具备红外对准系统 。

Product Name: KARL SUSS MICROTEC MA - 150 REMAN Mask AlignerPurpose: It is suitable for micro - nano processing fields such as semiconductor manufacturing, MEMS R & D, and optoelectronic device production. It can accurately transfer the mask pattern onto the surface of wafers and other substrate materials to complete the lithography process.Performance: It can handle wafers up to 6 inches in size and is suitable for 7×7 - inch masks. It has a topside alignment (TSA) function, with an alignment accuracy of up to ±5μm and a repeatability of ±1.5μm. There are controls for the movement of the wafer stage in the X, Y, and Theta directions. It is equipped with a 350W high - pressure mercury lamp with an exposure wavelength of 320nm. It supports four wafer - to - mask contact modes: standard soft, standard hard, soft vacuum, and full vacuum. The optical system includes a split - field revolving microscope with 3.5x, 10x, 25x objectives and 10x binocular eyepieces, and has three viewing modes: split - field, full left - hand image, and full right - hand image. It also has an infrared alignment system.