卡尔・休斯 KARL SUSS MICROTEC MA-150 CC BSA 掩模对准曝光机用途：适用于半导体制造、MEMS、光电子等微纳加工领域，可将掩模图案精准转移到晶圆等基底材料表面，完成光刻制程。常用于化合物半导体工艺，如高亮发光二极管、功率器件、RF - MEMS 等，也适用于先进封装，如 3D 圆晶级芯片尺寸封装。性能：能处理最大 6 英寸晶圆，适配 7×7 英寸掩模。具备顶部对准（TSA）和底部对准（BSA）功能，其中底部对准精确度优于 ±1.5µm 。有 X、Y、Theta、Z 方向的对准台，含楔形误差补偿功能。配备 350W 或 1000W 汞灯，曝光波长 320nm 。支持标准软接触、标准硬接触、软真空和全真空 4 种晶圆与掩模接触模式。光学系统含分视场旋转显微镜，搭配 5 倍、10 倍、20 倍物镜及 10 倍双目目镜，有分视场、全左图像、全右图像 3 种观察模式；还具备红外对准系统。

Product Name: KARL SUSS MICROTEC MA - 150 CC BSA Mask AlignerPurpose: It is suitable for micro - nano processing fields such as semiconductor manufacturing, MEMS, and optoelectronics. It can accurately transfer the mask pattern onto the surface of wafers and other substrate materials to complete the lithography process. It is often used in compound semiconductor processes, such as high - brightness light - emitting diodes, power devices, RF - MEMS, etc., and is also suitable for advanced packaging, such as 3D wafer - level chip - size packaging.Performance: It can handle wafers up to 6 inches in size and is suitable for 7×7 - inch masks. It has topside alignment (TSA) and bottom - side alignment (BSA) functions, with the BSA accuracy better than ±1.5µm. There are alignment stages in the X, Y, Theta, and Z directions, including wedge error compensation. It is equipped with a 350W or 1000W mercury lamp with an exposure wavelength of 320nm. It supports four wafer - to - mask contact modes: standard soft, standard hard, soft vacuum, and full vacuum. The optical system includes a split - field revolving microscope with 5x, 10x, 20x objectives and 10x binocular eyepieces, and has three viewing modes: split - field, full left - hand image, and full right - hand image. It also has an infrared alignment system.