EVG EVG 640R 掩模对准曝光机用途：适用于半导体制造、MEMS 研发、先进封装等领域，可将掩模图案精准转移到晶圆表面，完成光刻制程。主要用于处理最大 8 英寸（200mm）晶圆，也可用于相关科研与小规模生产。性能：分辨率小于 2μm，对准精度小于 0.5μm。具备 3D 卡盘设计，确保卡盘与掩模间均匀接触，提升对准精度；z 轴平台能实现小于 1 纳米的精确抗蚀剂曝光。自带自动对焦工具，可快速确定最佳曝光水平，减少晶圆夹紧对温度波动的敏感度。拥有集成式非接触注入装置，使抗蚀剂加载更高效；内置等离子清洗功能，加速基片准备；还有晶圆扫描仪，用于检测并修正曝光和边缘缺陷 。

Product Name: EVG EVG 640R Mask AlignerPurpose: It is suitable for fields such as semiconductor manufacturing, MEMS R & D, and advanced packaging. It can accurately transfer the mask pattern onto the wafer surface to complete the lithography process. It is mainly used for processing wafers up to 8 inches (200mm) in size and can also be used for related scientific research and small - scale production.Performance: The resolution is less than 2μm and the alignment accuracy is less than 0.5μm. It has a 3D chuck design to ensure uniform contact between the chuck and the mask, improving alignment accuracy. The z - axis stage can achieve accurate resist exposure of less than 1 nanometer. It has an autofocus tool that can quickly determine the optimal exposure level and reduce the sensitivity of wafer clamping to temperature fluctuations. It has an integrated non - contact injection device for more efficient resist loading, a built - in plasma cleaning function to accelerate substrate preparation, and a wafer scanner for detecting and correcting exposure and edge defects.