EVG EVG 620TBR 掩模对准曝光机用途：适用于半导体制造、MEMS 研发、先进封装等领域，可处理最大 6 英寸（150mm）晶圆。能将掩模图案精准转移到晶圆表面，完成光刻制程，常用于科研及小规模生产。性能：具备顶部对准（TSA）和背面对准（BSA）功能，10x 物镜用于辅助观察对准。支持接近式、软接触、硬接触、真空接触等曝光模式。350W 灯源（也可选 500W 灯源或升级为 LED）搭配 C 型曝光光学元件，提供 350nm - 450nm 宽带光。配备自动楔形补偿系统，可提高曝光一致性。操作界面基于微软 Windows 系统，便于使用 。

Product Name: EVG EVG 620TBR Mask AlignerPurpose: It is suitable for fields such as semiconductor manufacturing, MEMS R & D, and advanced packaging. It can handle wafers up to 6 inches (150mm) in size. It can accurately transfer the mask pattern onto the wafer surface to complete the lithography process and is often used in scientific research and small - scale production.Performance: It has topside alignment (TSA) and backside alignment (BSA) functions, with 10x objectives for auxiliary observation and alignment. It supports exposure modes such as proximity, soft contact, hard contact, and vacuum contact. A 350W light source (a 500W light source can also be selected or upgraded to LED) is paired with type C exposure optics to provide broadband light of 350nm - 450nm. It is equipped with an automatic wedge compensation system to improve exposure consistency. The operation interface is based on the Microsoft Windows system for easy use.