阿斯麦 ASML Twinscan XT 1250D 光刻机用途：用于半导体芯片制造，主要针对 200mm 和 300mm 晶圆开展光刻作业，适用于 65nm 制程的大规模生产，也可助力 45nm 制程的前期研发。通过将掩模版上的电路图形精准曝光至涂光刻胶的晶圆表面，完成光刻关键制程，在逻辑芯片、存储芯片等制造环节发挥重要作用。性能：采用 193nm ArF 激光光源，搭配数值孔径 0.85 的光学系统，可实现 70nm 的分辨率。具备先进双晶圆台技术，一个晶圆曝光时，另一晶圆可同步完成测量与对准，每小时约能处理 114 片 300mm 晶圆 。套刻精度（均值 + 3σ）≤30nm 。拥有全面焦点控制系统，对边缘芯片也能精准聚焦。照明系统提供稳定均匀光照，保障光刻质量。其 Ultra - k1 套件可显著提升工艺宽容度、焦深和关键尺寸控制能力 。

Product Name: ASML Twinscan XT 1250D Lithography MachinePurpose: It is used in semiconductor chip manufacturing, mainly performing lithography operations on 200mm and 300mm wafers. It is suitable for mass production of 65nm processes and can also contribute to the pre - production R & D of 45nm processes. By accurately exposing the circuit patterns on the photomask onto the surface of the wafer coated with photoresist, it completes the key lithography process and plays an important role in the manufacturing of logic chips, memory chips, etc.Performance: It adopts a 193nm ArF laser light source and is equipped with an optical system with a numerical aperture of 0.85, which can achieve a resolution of 70nm. It has advanced dual - wafer stage technology. While one wafer is being exposed, the other can be measured and aligned simultaneously, and it can process about 114 300mm wafers per hour. The overlay accuracy (mean + 3σ) is ≤30nm. It has a comprehensive focus control system that can accurately focus on edge dies. The illumination system provides stable and uniform illumination to ensure the lithography quality. Its Ultra - k1 package can significantly improve process latitude, depth of focus and critical dimension control capabilities.