阿斯麦 ASML PAS 2500 / 40用途：用于半导体芯片制造，可将掩模版上的电路图形精准转移至涂有光刻胶的晶圆表面，适用于 0.7 微米制程的集成电路生产，能处理 3 英寸、4 英寸、5 英寸和 6 英寸晶圆，在逻辑芯片、存储芯片等制造中发挥作用 。性能：采用 365nm i-line 光源，搭配数值孔径 0.40 的 i-line 镜头，像场直径 21.1mm ，可实现 0.7 微米分辨率 。该设备针对 i-line 工艺下 0.7 微米以下的生产分辨率进行了优化，套刻性能良好，有助于保障芯片制造过程中图形转移的准确性与稳定性，提高芯片生产效率和良品率 。

Product Name: ASML PAS 2500 / 40Purpose: It is used in semiconductor chip manufacturing to accurately transfer the circuit patterns on the photomask to the surface of the wafer coated with photoresist. It is suitable for the production of integrated circuits with a 0.7 - micron process and can process 3 - inch, 4 - inch, 5 - inch, and 6 - inch wafers, playing a role in the manufacturing of logic chips, memory chips, etc.Performance: It adopts a 365nm i-line light source and is equipped with a 0.40 numerical aperture i-line lens with an image field diameter of 21.1mm, which can achieve a resolution of 0.7 microns. The equipment is optimized for production resolutions below 0.7 microns in i-line processes and has good overlay performance, which helps to ensure the accuracy and stability of pattern transfer during the chip manufacturing process and improve chip production efficiency and yield.