卡尔・休斯 KARL SUSS MICROTEC MA 200 掩模对准曝光机用途：适用于半导体、MEMS、先进封装等领域，可对最大 200mm（8 英寸）的晶圆及方形衬底进行自动化光刻。常用于厚胶工艺 MEMS 生产、3D 结构制造、3D 封装、扇出封装、凸点封装、化合物半导体及图像传感器制造等。性能：支持 2 英寸 - 200mm 的晶圆，晶圆厚度可至 120μm，最大翘曲 5 - 6mm。曝光光源为 1000W，通过 SUSS CIC 1000 电源供电，搭配 UV400 曝光光学元件，提供 365nm 和 405nm 波长光线。顶部对准精度 0.5μm/3σ（TSA、AutoAL、DirectAlign），大视场对准精度 1μm，预对准精度＜50μm 。分辨率方面，20μm 接近式曝光为 3μm，100μm 间隙曝光为 7μm，150μm 间隙曝光为 10μm 。支持真空接触、硬接触、软接触、接近式、泛光曝光等模式。配备 SUSS DVM 8 双视频显微镜，含 5x、10x、20x 物镜，有盒对盒自动传输功能，可连续运行并更换晶圆盒 。

Product Name: KARL SUSS MICROTEC MA 200 Mask AlignerPurpose: It is suitable for fields such as semiconductors, MEMS, and advanced packaging. It can perform automated lithography on wafers and square substrates up to 200mm (8 inches) in size. It is often used in the production of MEMS with thick - film processes, the manufacturing of 3D structures, 3D packaging, fan - out packaging, bump packaging, compound semiconductors, and the manufacturing of image sensors.Performance: It supports wafers from 2 inches to 200mm, with a wafer thickness down to 120μm and a maximum warpage of 5 - 6mm. The exposure light source is 1000W, powered by a SUSS CIC 1000 power supply, and equipped with UV400 exposure optics to provide light at wavelengths of 365nm and 405nm. The topside alignment accuracy is 0.5μm/3σ (TSA, AutoAL, DirectAlign), the large - clear - field alignment accuracy is 1μm, and the pre - alignment accuracy is < 50μm. In terms of resolution, it is 3μm for 20μm proximity exposure, 7μm for 100μm gap exposure, and 10μm for 150μm gap exposure. It supports exposure modes such as vacuum contact, hard contact, soft contact, proximity, and flood exposure. It is equipped with a SUSS DVM 8 dual - video microscope, including 5x, 10x, and 20x objectives, and has a cassette - to - cassette automatic transfer function, allowing continuous operation and wafer cassette replacement.