卡尔・休斯 KARL SUSS MICROTEC MA 150 M/BSA 掩模对准曝光机用途：适用于半导体制造、MEMS 研发、微纳结构制作等领域，可对最大 6 英寸（150mm）的晶圆及基底进行光刻，完成掩模图案向基底的精准转移。常用于处理小尺寸晶圆、芯片及非标准基底。性能：曝光光源为 350W 汞灯等可选，提供多种波长光线。具备顶部对准（TSA）及底部对准（BSA）功能，底部对准精度优于 ±1.5μm 。支持接近式、软接触、硬接触、真空接触等曝光模式。显微镜配备 5x、10x、20x 等物镜，辅助精确对准。晶圆台具备 X、Y、θ 微调器，可控制移动。可处理最大 6 英寸晶圆，兼容小尺寸晶圆及最大 7x7 英寸的掩模，有盒对盒传输功能，具备楔形误差补偿系统，保障曝光一致性 。

Product Name: KARL SUSS MICROTEC MA 150 M/BSA Mask AlignerPurpose: It is suitable for fields such as semiconductor manufacturing, MEMS R & D, and micro - nano structure fabrication. It can perform lithography on wafers and substrates up to 6 inches (150mm) in size, accurately transferring the mask pattern onto the substrate. It is often used for processing small - sized wafers, chips, and non - standard substrates.Performance: The exposure light source can be a 350W mercury lamp, etc., providing a variety of wavelength lights. It has topside alignment (TSA) and bottom - side alignment (BSA) functions, with the bottom - side alignment accuracy better than ±1.5μm. It supports exposure modes such as proximity, soft contact, hard contact, and vacuum contact. The microscope is equipped with 5x, 10x, 20x and other objectives to assist in precise alignment. The wafer stage has X, Y, θ fine - adjusters to control movement. It can handle wafers up to 6 inches in size, is compatible with small - sized wafers and masks up to 7x7 inches, has a cassette - to - cassette transfer function, and is equipped with a wedge error compensation system to ensure exposure consistency.