阿斯麦 ASML XT 760F 光刻机用途：用于半导体芯片制造，可处理 200mm 与 300mm 晶圆，在 90nm - 130nm 制程的芯片生产中发挥重要作用，通过将掩模版上的电路图形高精度地曝光至涂胶晶圆表面，完成光刻制程，适用于逻辑芯片、存储芯片及相关传感器的制造环节。性能：采用 248nm KrF 激光光源，搭配数值孔径为 0.63 的光学系统，可实现≤110nm 的分辨率 。套刻精度（均值 + 3σ）≤25nm 。具备先进的双晶圆台技术，允许同时进行曝光和对准操作，提高生产效率，每小时可处理约 250 片 300mm 晶圆或 300 片 200mm 晶圆 。设备配备高精度的自动对焦与对准系统，能够精准定位晶圆与掩模版，保障图案转移的准确性，其照明系统可提供稳定且均匀的光照，确保光刻质量 。

Product Name: ASML XT 760F Lithography MachinePurpose: It is used in semiconductor chip manufacturing and can process 200mm and 300mm wafers. It plays an important role in the production of chips with 90nm - 130nm processes. By exposing the circuit patterns on the photomask onto the surface of the coated wafer with high precision, the lithography process is completed. It is suitable for the manufacturing of logic chips, memory chips and related sensors.Performance: It adopts a 248nm KrF laser light source and is equipped with an optical system with a numerical aperture of 0.63, which can achieve a resolution of ≤110nm. The overlay accuracy (mean + 3σ) is ≤25nm. It has advanced dual - wafer stage technology, allowing simultaneous exposure and alignment operations to improve production efficiency. It can process about 250 300mm wafers or 300 200mm wafers per hour. The equipment is equipped with a high - precision autofocus and alignment system, which can accurately position the wafer and the reticle to ensure the accuracy of pattern transfer. Its illumination system can provide stable and uniform illumination to ensure the lithography quality.