EVG EVG 640 掩模对准曝光机用途：广泛应用于半导体制造、MEMS 研发、先进封装等领域。能将掩模图案精确转移到晶圆表面，完成光刻制程。可处理最大 8 英寸（200mm）晶圆，常用于科研及小规模生产。性能：分辨率小于 2μm ，对准精度小于 0.5μm。3D 卡盘设计，保证卡盘与掩模均匀接触，提升对准精度；z 轴平台可实现小于 1 纳米的精确抗蚀剂曝光。自带自动对焦工具，能快速确定最佳曝光水平，降低晶圆夹紧对温度波动的敏感度。集成非接触注入装置，让抗蚀剂加载更高效；具备内置等离子清洗功能，加速基片准备；还有晶圆扫描仪，用于检测和修正曝光及边缘缺陷。

Product Name: EVG EVG 640 Mask AlignerPurpose: Widely used in semiconductor manufacturing, MEMS R & D, advanced packaging and other fields. It can accurately transfer the mask pattern onto the wafer surface to complete the lithography process. It can handle wafers up to 8 inches (200mm) in size and is often used in scientific research and small - scale production.Performance: The resolution is less than 2μm, and the alignment accuracy is less than 0.5μm. The 3D chuck design ensures uniform contact between the chuck and the mask, improving alignment accuracy. The z - axis stage can achieve accurate resist exposure of less than 1 nanometer. It has an autofocus tool that can quickly determine the optimal exposure level and reduce the sensitivity of wafer clamping to temperature fluctuations. It has an integrated non - contact injection device for more efficient resist loading, a built - in plasma cleaning function to accelerate substrate preparation, and a wafer scanner for detecting and correcting exposure and edge defects.