卡尔・休斯 KARL SUSS MICROTEC MA 6 / BA 6 掩模对准曝光机用途：适用于 MEMS、先进封装、化合物半导体等领域，可将掩模图案精准转移到晶圆等基底表面，完成光刻制程。常用于处理 2 英寸至 6 英寸的晶圆及尺寸达 6”x6” 的样品片。性能：曝光光源波长有 320nm 等可选。具备顶部和背面对准功能，正面对准精度可达 ±0.5μm，背面对准精度约 ±1μm。可处理 2 英寸至 6 英寸的晶圆。支持硬接触、软接触、真空接触等曝光模式。显微镜配备 5 倍、10 倍物镜等。能实现从 5mm x 5mm 芯片尺寸到 100mm 晶圆的图案化和对准，最大晶圆厚度 10mm 。

Product Name: KARL SUSS MICROTEC MA 6 / BA 6 Mask AlignerPurpose: It is suitable for fields such as MEMS, advanced packaging, and compound semiconductors. It can accurately transfer the mask pattern onto the surface of wafers and other substrates to complete the lithography process. It is often used for processing wafers from 2 inches to 6 inches and sample pieces up to 6”x6”.Performance: The exposure light source has optional wavelengths such as 320nm. It has top - side and back - side alignment functions, with the top - side alignment accuracy reaching ±0.5μm and the back - side alignment accuracy about ±1μm. It can handle wafers from 2 inches to 6 inches. It supports exposure modes such as hard contact, soft contact, and vacuum contact. The microscope is equipped with 5x, 10x objectives, etc. It can achieve patterning and alignment from 5mm x 5mm chip size to 100mm wafers, with a maximum wafer thickness of 10mm.