佳能 CANON PLA 600F 掩模对准曝光机用途：适用于半导体制造、光掩模制作、蚀刻工艺等领域，可处理最大 6 英寸晶圆，用于将掩模图案精准转移至晶圆表面，完成光刻制程，满足芯片、集成电路等微电子产品生产需求。性能：采用 250W 高压汞灯，经滤光产生特定波长光线用于曝光。具备降低衍射的光学系统，接触式印刷分辨率达 1 微米，接近式印刷分辨率为 3 微米。支持手动对准，可实现高精度图案定位。目前配置为可对 150mm 晶圆进行盒对盒处理，设备在光刻作业中能保证图案转移的准确性和稳定性 。

Product Name: CANON PLA 600F Mask AlignerPurpose: It is suitable for fields such as semiconductor manufacturing, photomask fabrication, and etching processes. It can handle wafers up to 6 inches in size and is used to accurately transfer the mask pattern onto the wafer surface to complete the lithography process, meeting the production requirements of micro - electronic products such as chips and integrated circuits.Performance: It uses a 250W high - pressure mercury lamp to generate specific wavelength light for exposure after filtering. It has an optical system that reduces diffraction, with a resolution of 1 micrometer in contact printing and 3 micrometers in proximity printing. It supports manual alignment, enabling high - precision pattern positioning. Currently, it is configured to perform cassette - to - cassette processing of 150mm wafers, and the equipment can ensure the accuracy and stability of pattern transfer during lithography operations.