迈达斯 MIDAS MDA-12FA 掩模对准曝光机用途：适用于陶瓷、探针卡以及晶圆级封装（WLP）等应用场景，用于将掩模图案精确转移到基底材料上，完成光刻制程。性能：采用半自动化设计，操控便捷。可处理最大 12 英寸 ×12 英寸（或片状）的基板，适配最大 13 英寸 ×13 英寸的掩模。配备 2kW 或 5kW 的紫外灯及相应电源，光束波长 350 - 450nm，365nm 强度在 2kW 时为 15 - 20mW/cm² ，5kW 时为 25 - 60mW/cm² ，均匀光束尺寸 13.25 英寸 ×13.25 英寸，均匀性＜±5%。对准精度达 1μm，在 1μm 光刻胶厚度且真空接触下，工艺分辨率为 1μm。支持软接触、硬接触、真空接触和接近式等多种工艺模式。拥有 100 多个程序配方，可实现全自动舞台运动，具备图像采集、数据记录及自动对齐功能 。

Product Name: MIDAS MDA - 12FA Mask AlignerPurpose: It is suitable for applications such as ceramics, probe cards, and wafer - level packaging (WLP). It is used to accurately transfer the mask pattern onto the substrate material to complete the lithography process.Performance: It adopts a semi - automated design for convenient operation. It can process substrates up to 12 inches × 12 inches (or pieces) and is suitable for masks up to 13 inches × 13 inches. It is equipped with a 2kW or 5kW UV lamp and the corresponding power supply. The beam wavelength is 350 - 450nm. The intensity at 365nm is 15 - 20mW/cm² for a 2kW lamp and 25 - 60mW/cm² for a 5kW lamp. The uniform beam size is 13.25 inches × 13.25 inches with a uniformity of < ±5%. The alignment accuracy reaches 1μm, and the process resolution is 1μm at a 1μm photoresist thickness under vacuum contact. It supports multiple process modes such as soft contact, hard contact, vacuum contact, and proximity. It has more than 100 program recipes, can achieve fully automatic stage movement, and has functions such as image acquisition, data recording, and automatic alignment.