阿斯麦 ASML XTII / 1400F 光刻机用途：用于半导体芯片制造，可对 200mm 与 300mm 晶圆进行光刻操作，在 65nm 制程的大规模生产中发挥关键作用，也适用于 45nm 制程的前期测试与研发，通过将掩模版上的集成电路图形，高精度、高效率地曝光至涂胶硅片表面，完成光刻制程。性能：采用 193nm ArF 光源，搭配数值孔径 0.65 - 0.93 的卡尔蔡司镜头与 Aerial E 照明器，推动 ArF 技术超越 65nm 节点。双晶圆台设计允许同时进行曝光和对准，提升生产效率，其 45W ArF 激光器，每小时可处理 133 片 300mm 晶圆或 165 片 200mm 晶圆。具备全面的焦点控制系统，针对边缘芯片也能精准聚焦，专为极低 k1 值操作设计，增强了工艺精度，内置测量技术用于先进的工艺追踪 。

Product Name: ASML XTII / 1400F Lithography MachinePurpose: It is used in semiconductor chip manufacturing and can perform lithography on 200mm and 300mm wafers. It plays a key role in the mass production of 65nm processes and is also suitable for pre - production testing and R & D of 45nm processes. By exposing the integrated circuit patterns on the photomask onto the surface of the coated silicon wafer with high precision and high efficiency, the lithography process is completed.Performance: It adopts a 193nm ArF light source, is equipped with a Carl Zeiss lens with a numerical aperture of 0.65 - 0.93 and an Aerial E illuminator, pushing ArF technology beyond the 65nm node. The dual - wafer stage design allows for simultaneous exposure and alignment, improving production efficiency. Its 45W ArF laser can process 133 300mm wafers or 165 200mm wafers per hour. It has a comprehensive focus control system that can accurately focus on edge dies. It is designed for extremely low k1 value operations, enhancing process precision, and has built - in metrology technology for advanced process tracking.