阿斯麦 ASML Twinscan 1700i 光刻机用途：主要用于半导体芯片制造领域，专注于 300mm 晶圆的大规模生产，能够实现 45nm 制程芯片的量产，也可用于 32nm 制程的前期研发工作，通过将掩模版上的精细电路图案精准曝光到涂有光刻胶的晶圆表面，完成光刻工序，助力制造高性能芯片。性能：采用 193nm ArF 浸没式光刻技术，搭配数值孔径达 1.2 的在线折反射镜头，该镜头由蔡司与 ASML 联合设计，融合折射与反射组件，制造成本合理且尺寸与 ASML 其他系统适配 。照明系统在最大吞吐量下具备偏振功能，光瞳填充均匀，能提升对比度与曝光宽容度，使分辨率从 50nm 提升至 45nm 。拥有行业最大的 26mm×33mm 最大扫描视场。套刻精度符合 45nm 制程标准，每小时可处理 122 片 300mm 晶圆 。

Product Name: ASML Twinscan 1700i Lithography MachinePurpose: It is mainly used in the semiconductor chip manufacturing field, focusing on the mass production of 300mm wafers. It can achieve the mass production of 45nm process chips and can also be used for the pre - production R & D of 32nm processes. By accurately exposing the fine circuit patterns on the photomask onto the surface of the wafer coated with photoresist, the lithography process is completed, helping to manufacture high - performance chips.Performance: It adopts 193nm ArF immersion lithography technology and is equipped with an in - line catadioptric lens with a numerical aperture of 1.2. The lens is jointly designed by Zeiss and ASML, integrating refractive and reflective components. The manufacturing cost is reasonable and the size is adaptable to other ASML systems. The illumination system has a polarization function at the maximum throughput and a uniform pupil fill, which can improve contrast and exposure latitude, increasing the resolution from 50nm to 45nm. It has the largest 26mm×33mm maximum scanning field in the industry. The overlay accuracy meets the standards of the 45nm process, and it can process 122 300mm wafers per hour.