佳能 CANON PLA 500F 掩模对准曝光机用途：适用于半导体制造、微机电系统（MEMS）研发、集成电路生产等领域，可处理最大 4 英寸晶圆，用于将掩模图案精准转移至晶圆表面，完成光刻制程，满足芯片、传感器等微小精密部件的制造及科研需求。性能：最小分辨率约 2μm，套刻精度 ±2μm。掩膜版尺寸为 5 英寸 ×5 英寸。对准间隙 0 - 98μm，曝光间隙 0 - 48μm。操作杆可扫视范围 X 方向 10mm、Y 方向 10mm。曝光方式可在接近式、硬接触和软接触模式间转换。可用光波由 g 线、h 线和 i 线合成，积分光量计设定量能以 0.1 为单位在 0 - 59.9 间变动。具备自动 / 手动传片功能，有自动找平功能，能适配不同类型的圆片。

Product Name: CANON PLA 500F Mask AlignerPurpose: It is suitable for fields such as semiconductor manufacturing, micro - electromechanical systems (MEMS) R & D, and integrated circuit production. It can process wafers up to 4 inches in size and is used to accurately transfer the mask pattern onto the wafer surface to complete the lithography process, meeting the manufacturing and research needs of tiny and precise components such as chips and sensors.Performance: The minimum resolution is about 2μm, and the overlay accuracy is ±2μm. The mask size is 5 inches × 5 inches. The alignment gap is 0 - 98μm, and the exposure gap is 0 - 48μm. The scanning range of the operating rod is 10mm in the X - direction and 10mm in the Y - direction. The exposure method can be switched among proximity, hard contact, and soft contact modes. The available light waves are composed of g - line, h - line, and i - line. The set value of the integrating photometer can vary from 0 to 59.9 in units of 0.1. It has automatic/manual wafer transfer functions and an automatic leveling function, which can be adapted to different types of wafers.