阿斯麦 ASML AT-850C用途：是一款用于半导体制造的光刻设备，在芯片制造流程中，它通过光线将掩模版上的电路图案投射到晶圆表面的光刻胶上，经过后续处理实现电路图形的转移，常用于 110nm 逻辑和存储芯片的大规模生产，助力集成电路产品制造 。性能：于 2003 - 2004 年推出，采用 248nm KrF 深紫外光源，数值孔径达 0.80 ，可实现 110nm 制程 。配备高速、高分辨率晶圆台与自动对焦功能，在扫描大小基板时能保持高精度。其超高速扫描速度可达 320mm / 秒，曝光速度达 18mm / 秒，套刻精度可达 5nm 。装备先进 CCD 相机工具确保精准成像，分辨率达 128nm ，可捕捉纳米级特征。搭载双晶扫描技术提升分辨率与扫描速度，还有激光测量系统精确对准掩模版和晶圆，保障光刻过程的精准度与稳定性 。

Product Name: ASML AT-850CPurpose: It is a lithography device used in semiconductor manufacturing. In the chip manufacturing process, it projects the circuit patterns on the photomask onto the photoresist on the wafer surface through light, and realizes the transfer of circuit patterns after subsequent processing. It is often used for the mass production of 110nm logic and memory chips, contributing to the manufacturing of integrated circuit products.Performance: Launched in 2003 - 2004, it adopts a 248nm KrF deep ultraviolet light source with a numerical aperture of up to 0.80, enabling an 110nm process. It is equipped with a high - speed, high - resolution wafer stage and an auto - focus function, which can maintain high accuracy when scanning large and small substrates. Its ultra - high - speed scanning speed can reach 320mm/second, the exposure speed is 18mm/second, and the overlay accuracy can reach 5nm. It is equipped with an advanced CCD camera tool to ensure accurate imaging, with a resolution of 128nm, which can capture nanoscale features. It uses dual - crystal scanning technology to improve resolution and scanning speed, and also has a laser measurement system to accurately align the photomask and the wafer, ensuring the accuracy and stability of the lithography process.