阿斯麦 ASML AT-1150C用途：该设备属于光刻系统，主要应用于半导体芯片制造领域。通过光刻技术，将掩模版上设计好的电路图形，借助光线精准地转移到涂有光刻胶的晶圆表面，进而用于制造各类集成电路芯片，尤其适用于 90nm 制程芯片的大规模生产 。性能：作为 Twinscan C 系列成员，该产品采用 193nm ArF 光源，搭配数值孔径达 0.75 的镜头，可实现 90nm 分辨率 。在实际生产条件下，对于 300mm 晶圆，其晶圆输出量每小时超 110 片（每片晶圆 109 次曝光），通过提升平台移动速度实现了约 15% 的产能提升，且维持了成像、对准和调平的精度 。设备配备先进的对准系统，能确保电路图形转移的准确性，为芯片制造提供稳定、高效的光刻支持 。

Product Name: ASML AT-1150CPurpose: This device belongs to a lithography system and is mainly applied in the semiconductor chip manufacturing field. Through lithography technology, it precisely transfers the pre - designed circuit patterns on the photomask to the surface of the wafer coated with photoresist by means of light, and is then used to manufacture various integrated circuit chips, especially suitable for the mass production of 90nm process chips.Performance: As a member of the Twinscan C series, this product uses a 193nm ArF light source and is equipped with a lens with a numerical aperture of up to 0.75, which can achieve a resolution of 90nm. Under actual production conditions, for 300mm wafers, its wafer output exceeds 110 wafers per hour (109 exposures per wafer). It has achieved a capacity increase of approximately 15% by increasing the platform movement speed and maintained the accuracy of imaging, alignment, and leveling. The equipment is equipped with an advanced alignment system, which can ensure the accuracy of circuit pattern transfer and provide stable and efficient lithography support for chip manufacturing.