阿斯麦 ASML Twinscan XT2 1700FI 光刻机用途：专为 300mm 晶圆的大规模芯片制造设计，可实现 50nm 及以下分辨率的光刻，适用于生产高性能、高集成度的逻辑芯片、存储芯片等，助力半导体工艺迈向更先进制程。性能：采用 193nm ArF 浸没式光刻技术，配备数值孔径 1.2 的紧凑且机械稳定性强的在线折反射镜头，与现有折射设计掩模版完全兼容。照明器在最大吞吐量下具备偏振功能，光瞳填充均匀，适配超低 k1 光瞳形状，优化偏振模式可增强照明效果，提升对比度并降低掩模误差因子。套刻与聚焦符合分辨率节点标准。先进平台技术实现快速加速，减少浸没相关额外时间，晶圆处理量达每小时 122 片。还配备包含多种增强功能的扩展超 k1 套件 。

Product Name: ASML Twinscan XT2 1700FI Lithography MachinePurpose: It is specifically designed for the mass - scale chip manufacturing of 300mm wafers. It can achieve lithography with a resolution of 50nm and below, and is suitable for the production of high - performance and highly integrated logic chips, memory chips, etc., helping the semiconductor process move towards more advanced nodes.Performance: It adopts 193nm ArF immersion lithography technology and is equipped with a 1.2 numerical aperture in - line catadioptric lens which is compact and has strong mechanical stability, and is fully compatible with existing refractive - designed reticles. The illuminator features polarization at maximum throughput and has a homogeneous pupil fill, perfectly adapted to ultra - low k1 pupil shapes. Optimizing the polarization mode can enhance the illumination effect, improve contrast and reduce the mask error factor. Overlay and focus meet the resolution node standards. The advanced stage technology enables fast acceleration and reduces immersion - related overhead time, with a wafer throughput of 122 wafers per hour. It is also equipped with an extended ultra - k1 package containing a variety of enhanced functions.