阿斯麦 ASML XT 1250D 光刻机用途：用于半导体芯片制造，能对 200mm 和 300mm 晶圆进行光刻操作，适用于 65nm 制程的大规模生产，以及 45nm 制程的前期测试与研发，通过把掩模版上的集成电路图形高精度、高效率地曝光到涂胶硅片表面，完成光刻流程。性能：采用 193nm ArF 激光光源，搭配数值孔径 0.85 的光学系统，可实现 70nm 分辨率 。具备先进的双晶圆台技术，一个晶圆进行曝光时，另一个可同步完成测量和对准，每小时能处理约 110 片 300mm 晶圆 。套刻精度（均值 + 3σ）≤30nm 。拥有全面的焦点控制系统，对边缘芯片也能精准聚焦。照明系统提供稳定均匀光照，保障光刻质量。此外，其 Ultra - k1 套件可显著提升工艺宽容度、焦深和关键尺寸控制能力 。

Product Name: ASML XT 1250D Lithography MachinePurpose: It is used in semiconductor chip manufacturing and can perform lithography on 200mm and 300mm wafers. It is suitable for mass production of 65nm processes and pre - production testing and R & D of 45nm processes. By exposing the integrated circuit patterns on the photomask onto the surface of the coated silicon wafer with high precision and high efficiency, the lithography process is completed.Performance: It adopts a 193nm ArF laser light source and is equipped with an optical system with a numerical aperture of 0.85, which can achieve a resolution of 70nm. It has advanced dual - wafer stage technology. While one wafer is being exposed, the other can be measured and aligned simultaneously, and it can process about 110 300mm wafers per hour. The overlay accuracy (mean + 3σ) is ≤30nm. It has a comprehensive focus control system that can accurately focus on edge dies. The illumination system provides stable and uniform illumination to ensure the lithography quality. In addition, its Ultra - k1 package can significantly improve process latitude, depth of focus and critical dimension control capabilities.