卡尔・休斯 KARL SUSS MICROTEC MA 760 掩模对准曝光机用途：适用于 MEMS、先进封装、化合物半导体等领域，可将掩模图案精准转移到晶圆等基底表面，完成光刻制程。常用于处理不同尺寸的晶圆及非标准基板。性能：可处理最大 8 英寸晶圆，兼容小尺寸晶圆及碎片。曝光光源通常为汞灯，波长范围 350 - 450nm，光强均匀性良好，能保障曝光一致性。具备顶部和背面对准功能，对准精度较高，正面套刻精度可达 ±0.5um 左右，背面套刻精度可达 ±1um 左右。支持多种曝光模式，如硬接触、软接触、真空接触和接近式曝光，接近式曝光调节范围灵活。光学系统搭配显微镜，可辅助精确对准操作。

Product Name: KARL SUSS MICROTEC MA 760 Mask AlignerPurpose: It is suitable for fields such as MEMS, advanced packaging, and compound semiconductors. It can accurately transfer the mask pattern onto the surface of wafers and other substrates to complete the lithography process. It is often used for processing wafers of different sizes and non - standard substrates.Performance: It can handle wafers up to 8 inches in size and is compatible with small - sized wafers and fragments. The exposure light source is usually a mercury lamp with a wavelength range of 350 - 450nm. The light intensity uniformity is good, ensuring exposure consistency. It has top - side and back - side alignment functions with high alignment accuracy. The front - side overlay accuracy can reach about ±0.5um, and the back - side overlay accuracy can reach about ±1um. It supports multiple exposure modes, such as hard contact, soft contact, vacuum contact, and proximity exposure, with a flexible adjustment range for proximity exposure. The optical system is equipped with a microscope to assist in precise alignment operations.