卡尔・休斯 KARL SUSS MICROTEC MA 4 Series III BSA 掩模对准曝光机

用途：主要用于半导体制造、微机电系统（MEMS）研发以及微纳结构制作等领域。可将掩模上的图案精准转移到晶圆或其他基底上，完成光刻工艺，适用于 4 英寸及以下尺寸晶圆或芯片加工12。

性能：配备分光显微镜，具有 5 倍、10 倍等物镜，具备顶部和背面对准功能（BSA）。曝光光源为 350W 高压汞灯，输出 365nm 和 405nm 波长光线，功率为 9.5-10.5mW。晶圆台可通过 X、Y 和 θ 微调器控制移动。有标准软接触、标准硬接触、软真空和全真空四种晶圆与掩模接触模式，真空模式仅适用于标准 5 英寸玻璃掩模搭配 4 英寸晶圆，可实现不同分辨率需求1。

Product Name: KARL SUSS MICROTEC MA 4 Series III BSA Mask Aligner

Purpose: It is mainly used in semiconductor manufacturing, MEMS R & D, and micro - nano structure fabrication. It can accurately transfer the pattern on the mask to the wafer or other substrates to complete the lithography process, and is suitable for the processing of wafers or chips with a size of 4 inches and below12.

Performance: It is equipped with a split - field microscope and has objectives such as 5x and 10x, with topside and backside alignment (BSA) functions. The exposure light source is a 350W high - pressure mercury lamp, which outputs light with wavelengths of 365nm and 405nm, and the power is 9.5 - 10.5mW. The wafer stage movement is controlled by X, Y and theta aligning verniers. There are four wafer - to - mask contact modes, namely standard soft contact, standard hard contact, soft vacuum and full vacuum. The vacuum mode is only applicable to the standard 5 - inch glass mask with 4 - inch wafers, which can meet different resolution requirements1.