阿斯麦 ASML Twinscan XT 1700i 光刻机用途：用于半导体芯片制造，专注于 300mm 晶圆的大规模生产，可实现 45nm 制程的芯片量产，也适用于 32nm 制程的前期研发，通过将掩模版上的精细电路图案精准曝光到涂有光刻胶的晶圆表面，完成光刻工序，助力生产高性能芯片 。性能：采用 193nm ArF 浸没式光刻技术，搭配数值孔径 1.2 的在线折反射镜头，该镜头由蔡司与 ASML 共同设计，结合折射与反射组件，制造成本合理且尺寸与其他 ASML 系统一致 。照明系统在最大吞吐量下具备偏振功能，光瞳填充均匀，能有效提升对比度与曝光宽容度，使分辨率从 50nm 提升至 45nm 。最大扫描视场为 26mm×33mm，为行业最大。套刻精度符合 45nm 制程标准，每小时可处理 122 片 300mm 晶圆 。

Product Name: ASML Twinscan XT 1700i Lithography MachinePurpose: It is used in semiconductor chip manufacturing, focusing on the mass production of 300mm wafers. It can achieve the mass production of chips with a 45nm process and is also suitable for the pre - production R & D of the 32nm process. By accurately exposing the fine circuit patterns on the photomask onto the surface of the wafer coated with photoresist, the lithography process is completed, helping to produce high - performance chips.Performance: It adopts 193nm ArF immersion lithography technology and is equipped with a 1.2 numerical aperture in - line catadioptric lens, which is co - designed by Zeiss and ASML, combining refractive and reflective components. The manufacturing cost is reasonable and the size is consistent with other ASML systems. The illumination system features polarization at maximum throughput and has a homogeneous pupil fill, which can effectively improve contrast and exposure latitude, increasing the resolution from 50nm to 45nm. The maximum scanning field is 26mm×33mm, the largest in the industry. The overlay accuracy meets the standards of the 45nm process, and it can process 122 300mm wafers per hour.