ABM/6/350/NUV/DCCD/BSV/M 双面对准曝光机1。用途：可实现各种非标准基片曝光、复杂微纳图案、正反双面曝光，用于制备微电子器件、多层硅通孔器件、柔性电子器件、MEMS 器件等，适用于半导体光刻工艺制程、光波导、光栅等诸多领域1。性能：配备 350W 近紫外光源，光强均匀性 2 英寸内＜±1%、4 英寸内＜±2%、6 英寸内＜±3%。365nm 光强输出强度＞20mW/cm²。具有硬接触、软接触、间隙式三种曝光模式。正面对准精度优于 ±1.0μm，背面对准精度优于 ±2.0μm。采用双 CCD 对位系统，图像放大倍率 100 倍 - 850 倍连续可调，能完成最小 15mm 晶圆双目双视场同时对准1。

Product Name: ABM/6/350/NUV/DCCD/BSV/M Double - Side Alignment Exposure Machine1.Purpose: It can realize exposure of various non - standard substrates, complex micro - nano patterns, front and back double - side exposure, and is used for preparing micro - electronic devices, multi - layer through - silicon via devices, flexible electronic devices, MEMS devices, etc. It is suitable for many fields such as semiconductor lithography process, optical waveguide, grating, etc1.Performance: Equipped with a 350W near - ultraviolet light source, the light intensity uniformity is <±1% within 2 inches, <±2% within 4 inches, and <±3% within 6 inches. The light intensity output at 365nm is >20mW/cm². It has three exposure modes: hard contact, soft contact, and gap - type. The front - side alignment accuracy is better than ±1.0μm, and the back - side alignment accuracy is better than ±2.0μm. It adopts a dual - CCD alignment system, and the image magnification can be continuously adjusted from 100x to 850x, which can complete the simultaneous alignment of the binocular dual - field of view of the smallest 15mm wafer1.