阿斯麦 ASML TWINSCAN AT 1150C 光刻机用途：用于半导体芯片制造，主要处理 200mm 和 300mm 晶圆，适用于 90nm 制程的大规模生产，也可用于 100nm 及以下制程的前期研发。通过将掩模版上的精细电路图形精准曝光到涂有光刻胶的晶圆表面，完成光刻工序，在逻辑芯片、存储芯片等制造中发挥关键作用 。性能：采用 193nm ArF 激光光源，搭配数值孔径 0.75 的光学系统，可实现 90nm 分辨率 。具备双晶圆台技术，一个晶圆曝光时，另一晶圆可同步完成测量和对准，显著提升生产效率，每小时能处理超 110 片 300mm 晶圆 。套刻精度满足 90nm 制程生产需求，拥有先进的 Athena 晶圆对准系统。其光路设计可实现高数值孔径与低畸变成像，还配备多种先进照明系统，支持对功率、波长和强度的多样选择，内部软件能进行高级的腔内图像算法处理与基于图像的决策 。

Product Name: ASML TWINSCAN AT 1150C Lithography MachinePurpose: It is used in semiconductor chip manufacturing, mainly processing 200mm and 300mm wafers. It is suitable for mass production of 90nm processes and can also be used for pre - production R & D of 100nm and below processes. By accurately exposing the fine circuit patterns on the photomask onto the surface of the wafer coated with photoresist, the lithography process is completed, playing a key role in the manufacturing of logic chips, memory chips, etc.Performance: It adopts a 193nm ArF laser light source and is equipped with an optical system with a numerical aperture of 0.75, which can achieve a resolution of 90nm. It has a dual - wafer stage technology. While one wafer is being exposed, the other wafer can be measured and aligned simultaneously, significantly improving production efficiency. It can process more than 110 300mm wafers per hour. The overlay accuracy meets the production requirements of the 90nm process, and it has an advanced Athena wafer alignment system. Its optical path design can achieve high numerical aperture and low - distortion imaging. It is also equipped with a variety of advanced illumination systems, supporting diverse selections of power, wavelength, and intensity. The internal software can perform advanced in - chamber image algorithm processing and image - based decisions.